Qorvo – Intel, Qorvo, and DoD Officially Celebrate Delivery of Microelectronics Advancements to the Defense Industrial Base
The U.S. Department of Defense (DoD) has celebrated a milestone achievement for the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Program under the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) with the delivery of the first SHIP prototype devices from Intel and Qorvo to BAE Systems, Inc.
The SHIP Program was established to develop pathways for sustained DoD access to state-of-the-art (SOTA) microelectronics packaging capabilities by leveraging commercial industry production flow to meet the DoD’s requirement for highly customized parts. Utilizing the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Agreement (OTA), the SHIP Program has partnered with Intel and Qorvo to develop prototype devices that will be transitioned to DoD systems through the Defense Industrial Base (DIB) to demonstrate enhanced capabilities and size, weight, and power (SWaP) savings beneficial to the warfighter. The first two of these prototypes – Intel’s Multi-Chip Package (MCP-1) for SHIP Digital and Qorvo’s Multi-Chip Module (MCM-1) for SHIP RF – were delivered to the lead DIB demonstrator, BAE Systems, Inc., during a ceremonial gathering held by Ms. Heidi Shyu, Under Secretary of Defense for Research and Engineering (USD(R&E)) and the S2MARTS OTA Manager, National Security Technology Accelerator (NSTXL), at BAE Systems’ facility in Falls Church, Virginia, on Thursday, April 6, 2023.